Workstations

1. Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4†/ v3 family; QPI up to 9.6GT/s 2. Up to 2TB† ECC 3DS LRDIMM , up to DDR4- 2400†MHz ; 16x DIMM slots

1. Single Socket H4 (LGA 1151) supports: 8th Generation Intel® Core™ i7/i5/i3 / Pentium® / Celeron® processor 2. Intel® Q370 chipset 3. Up to 32GB unbuf. non-ECC SO-DIMM, DDR4-2666Mz; in 2 DIMM slots 4. 1 PCI-E 3.0 x16 LP AOC slot, M.2 M key: PCI-E 3.0 x4, support 2242/2280; M.2 E KEY: PCI-E 3.0 x1, support 2230

Tower Server, Intel® Xeon® E-2200/ E-2100, Up to 128 DDR4, 4x PCI Gen3 slots, iRMC S5, Fujitsu software ISM, small & medium business, iRMC S5, Fujitsu software ISM

1. Dual socket R (LGA 2011) supports Intel® Xeon® processor E5-2600 and E5-2600 v2 family† 2. Up to 1TB ECC DDR3, up to 1866MHz; 16x DIMM slots 3. Expansion slots: 3 (x16) PCI-E 3.0, 2 (x8) PCI-E 3.0 & 1 (x4) PCI-E 3.0 4. Intel® i350 Dual port Gigabit Ethernet 5. 2x SATA3 and 8x SATA2 ports 6. 4x 3.5" SATA HDD bays, 90° rotating hard drive cage, 4x 2.5" internal HDD/SSD bays (opt.) 7. 900W High Efficiency Power Supply Gold Level Certified

1. Single socket R (LGA 2011) supports Intel® Xeon® processor E5-2600/1600 and E5-2600/1600 v2 family† 2. Up to 512GB ECC DDR3, up to 1866MHz; 8x DIMM slots 3. Expansion slots: 2 PCI-E 3.0 x16, 1 PCI-E 3.0 x4 (in x8), 1 PCI-E 2.0 x4 (in x8), 1x PCI-32 4. Intel® 82579LM and 82574L, 2x Gigabit Ethernet LAN ports 5. 4 USB 3.0 and 14 USB 2.0 ports 6. 4x 3.5" SATA3 HDD bays, 90° rotating hard drive cage, 4x 2.5" internal HDD/SSD bays (opt.) 7. 900W Gold Level Power Supply

1. Dual socket P (LGA 3647) supports Intel® Xeon® Scalable Processors, Dual UPI up to 10.4GT/s 2. Up to 1.5TB ECC 3DS LRDIMM, up to DDR4-2666MHz; 12 DIMM slots 3. Expansion slots: 1 PCI-E 3.0 x16 (LP) 1 PCI-E 3.0 x16 (for SIOM )

1. Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4†/ v3 family; QPI up to 9.6GT/s 2. Up to 2TB† ECC 3DS LRDIMM , up to DDR4- 2400†MHz ; 16x DIMM slots 3. Expansion slots: 1 PCI-E 3.0 x16 (LP) 1 PCI-E 3.0 x8 (Micro Low Profile)

1. Single Socket P (LGA 3647) support 2nd Gen Intel® Xeon® Scalable processors (Cascade Lake/Skylake)‡ Intel® Xeon® W-32xx processor 2. Intel® Xeon® Scalable Processors: Up to 3TB 3DS ECC RDIMM, DDR4-2933MHz; up to 2TB 3DS ECC LRDIMM, DDR4-2933MHz; or 3TB DCPMM, DDR4-2666MHz, in 12 DIMM slots. Intel® Xeon® W-3200 Processors: Up to 2TB 3DS ECC L/RDIMM; up to 1TB 3DS L/RDIMM. (Xeon® W-3200 doesn't support DCPMM.) 3. 4 PCI-E 3.0 x16, 3 PCI-E 3.0 x8 (in x16 slot) M.2 Interface: 4 PCI-E 3.0 x4, RAID 0, 1 M.2 Form Factor: 2242/2260/2280/22110 M.2 Key: M-Key 4. 1x 10GBase-T and 1x 1GbE LAN ports 5. 8 Hot-swap 3.5" SAS/SATA bay with SGPIO 6. 1 VGA port, VGA connector is dedicated for IPMI 7. 7.1 HD Audio 8. 2200W Redundant Power Supplies Titanium Level Certified

Dual Socket Tower Server, Intel® Xeon® Scalable Processor Family, Up to 1.5 TB GB DDR4, High efficiency hot-plug power supplies

Tower server, Up to 2x CPUs of the 4th Generation Intel Xeon, 16x high speed DDR5 DIMM slots (8TB, 4.800 MT/s), PCI-Express 4.0 x16: 4 x Full height

HPE ProLiant ML30 Gen10 Plus tower server with one Intel® Xeon® E-2314 processor, 16 GB memory, 8 small form factor hot-plug chassis, and one 500W hot-plug power supply

1. Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4†/ v3 family; QPI up to 9.6GT/s 2. Up to 1TB† ECC 3DS LRDIMM , up to DDR4- 2400†MHz ; 8x DIMM slots