6 Cores
Supermicro motherboards differ from their competitors in consistent design, high quality components and manufacturing knowledge, extensive offerings and a good price/performance ratio. They also feature standard sizes, maximizing compatibility with a wide range of chassis. If you don't know how to choose, don't hesitate to contact our sales referent: +1 (757) 909-6188
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4 products:
Products in category
Supermicro MBD-X10SDV-6C-TLN4F-B
1. Intel® Xeon® processor D-1528,
Single socket FCBGA 1667;
6-Core, 12 Threads, 35W
2. System on Chip
3. Up to 128GB ECC RDIMM DDR4
2133MHz or 64GB ECC/non-ECC
UDIMM in 4 sockets
4. 1 PCI-E 3.0 x16
$ 847.65
In stock
Stock allocation and delivery options
Delivery to selected address
Wednesday 11. 12. at the latest Friday 20. 12.
Wednesday 11. 12. at the latest Friday 20. 12.
Supermicro MBD-X10SDV-6C+-TLN4F-B
1. Intel® Xeon® processor D-1528,
Single socket FCBGA 1667;
6-Core, 12 Threads, 35W
2. System on Chip
3. Up to 128GB ECC RDIMM DDR4
2133MHz or 64GB ECC/non-ECC
UDIMM in 4 sockets
4. 1 PCI-E 3.0 x16
$ 862.08
ETA 3 weeks
Stock allocation and delivery options
Delivery to selected address
Thursday 2. 1. at the latest Thursday 27. 3.
Thursday 2. 1. at the latest Thursday 27. 3.
Supermicro MBD-X10SDV-6C+-TLN4F-O
1. Intel® Xeon® processor D-1528,
Single socket FCBGA 1667;
6-Core, 12 Threads, 35W
2. System on Chip
3. Up to 128GB ECC RDIMM DDR4
2133MHz or 64GB ECC/non-ECC
UDIMM in 4 sockets
4. 1 PCI-E 3.0 x16
$ 873.99
ETA 3 weeks
Stock allocation and delivery options
Delivery to selected address
Thursday 2. 1. at the latest Thursday 27. 3.
Thursday 2. 1. at the latest Thursday 27. 3.
Supermicro MBD-X10SDV-6C-TLN4F-O
1. Intel® Xeon® processor D-1528,
Single socket FCBGA 1667;
6-Core, 12 Threads, 35W
2. System on Chip
3. Up to 128GB ECC RDIMM DDR4
2133MHz or 64GB ECC/non-ECC
UDIMM in 4 sockets
4. 1 PCI-E 3.0 x16
$ 869.13
ETA 3 weeks
Stock allocation and delivery options
Delivery to selected address
Thursday 2. 1. at the latest Thursday 27. 3.
Thursday 2. 1. at the latest Thursday 27. 3.
