Storage Servers

Dual socket 3rd Gen Intel® Xeon® Scalable processors, up to 72 Cores Per Node, 16 ECC DDR4-3200: LRDIMM/RDIMM, 3 x PCI-E 4.0 x16 Slots, Dedicated PCI-E 4.0 AIOM slot

Dual Socket E (LGA-4677) 5th/4th Gen Intel® Xeon® Scalable processors Up to 4TB 3DS ECC RDIMM, DDR5-5600MT/s(1DPC) in 16 DIMM slots 2x 10 GbE onboard via Broadcom BCM57416 1x GbE Dedicated LAN for server remote management: IPMI 2.0 / KVM over LAN / Media over LAN 12x 3.5"/2.5" Hot-swap SAS3/SATA3 drives, 2x Rear 2.5" SATA Slots, 2x NVMe M.2 (form factor: 2280 and 22110)

Dual socket 3rd Gen Intel® Xeon® Scalable processors, up to 72 Cores Per Node 16 ECC DDR4-3200: LRDIMM/RDIMM + 2 Intel® Optane™ Persistent Memory Dedicated Slots 2x 10Gbe Server remote management: IPMI 2.0 / KVM over LAN / Media over LAN per node 36 3.5"/2.5" Hot-swap SAS3/SATA3 drives (4 Hybrid NVMe), 2x Rear SATA Slots, 1x SATA/NVMe M.2 (form factor: 2280 and 22110) 7x 8cm hot-swap counter-rotate redundant PWM cooling fans 1600W Redundant Power Supplies Titanium Level (96%) HW RAID support via Broadcom® 3908

XN5112D, NXT, Dual CTRL, Intel 4core Xeon, DDR4 16G, 10GbE SFP+*8, 2U12, GBIC*4, Rail kit

1. Dual Node (HA), Enterprise High Availability (SBB) Architecture (shared storage); Fully serviceable and redundant Two hot-pluggable systems (nodes) in a 4U form factor. Each node supports the following: 2. Dual Socket P (LGA 3647) support 2nd Gen Intel® Xeon® Scalable processors (Cascade Lake/Skylake)‡ 3. 16 DIMMs; up to 4TB 3DS ECC DDR4-2933MHz† RDIMM/LRDIMM, Supports Intel® Optane™ DCPMM†† 4. 2 PCI-E 3.0 x16 (HHHL), 1 PCI-E 3.0 x8 (HHHL) 5. 90x 3.5"/2.5" Hot-swap SAS3 drives, 2x Fixed slim SATA SSD, 2x NVMe M.2 (form factor: 22110) 6. Dual Broadcom 3616 IT Mode 7. Server remote management: IPMI 2.0 / KVM over LAN / Media over LAN 8. 6x 8cm hot-swap counter-rotate redundant PWM cooling fans 9. 2600W Redundant Power Supplies Titanium Level (96%) 10. Dedicated node to node connectivity featuring high performance NTB PCI-E 3.0 x16 , 1G private Ethernet, and IPMI for robust node fail-over support

2x Intel Xeon E5-2630 v2 128GB memory per node 6x 2.5in 400GB SSD Hard Drives 30x 3.5in 4TB SATA3 HDDs Internal 2.5in OD drives (mirrored 80GB SSD) 4x 10G SFP+ via 2x AOC-STGN-I2S

Single-Controller FAS System, max 128GB RAM, 2 x 10GbE BASE-T iSCSI, redundant power supply, 2 slots for optional host cards (Slot 1 & Slot 2: Optional host cards for 2/4 x 32/16Gb Fibre Channel, or 2/4 x 25/10Gb iSCSI) Slide Rail Kit (SLR-RM3640), C2F Module (C2F-BM256G)

1. Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4†/ v3 family; QPI up to 9.6GT/s 2. Up to 3TB† ECC 3DS LRDIMM , up to DDR4- 2400†MHz ; 24 DIMM slots 3. 6 PCI-E 3.0 x8 slots (4 FH, 10.5" L, 1 LP, 1 Internal LP) 4. 4x 10GBase-T ports 5. 12 Hot-swap 3.5" Drive Bays: Default 8 SATA3 ports, 4 NVMe ports; Optional 12 SAS3 ports via AOC; Optional 2 hot-swap 2.5" rear drive bays for SSDs 6. 4 heavy duty fans w/ optimal fan speed control 7. 1000W High efficiency (96%) Redundant PSU; Titanium Level

1. Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4†/ v3 family; QPI up to 9.6GT/s 2. Up to 2TB† ECC 3DS LRDIMM , up to DDR4- 2400†MHz ; 16x DIMM slots

1. Dual Socket P (LGA 3647) support Intel® Xeon® Scalable Processors 2. Up to 3TB 3DS ECC LRDIMM, up to DDR4-2666MHz; 24 DIMM slots 3. 2 PCI-E 3.0 x16 Low-profile slots 4. 32 Hot-swap Ruler SSDs, individual SSD power cycling

1. Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4†/ v3 family; QPI up to 9.6GT/s 2. Up to 2TB† ECC 3DS LRDIMM , up to DDR4- 2400†MHz ; 16x DIMM slots 3. 1 PCI-E 3.0 x16, 6 PCI-E 3.0 x8

XN8116D, NXT, Dual CTRL, Intel 4core Xeon, DDR4 32G, 10GbE SFP+*8, 3U16, GBIC*4, Rail kit