Storage Servers

1. Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4†/ v3 family; QPI up to 9.6GT/s 2. Up to 2TB† ECC 3DS LRDIMM , up to DDR4- 2400†MHz ; 16x DIMM slots 3. 1 PCI-E 3.0 x16, 6 PCI-E 3.0 x8 (slot 1 & 2 occupied by controller and JBOD expansion port) 4. Dual 10GBase-T LAN w/ Intel® X540 5. 36x 3.5" Hot-swap drive bays (24 front + 12 rear): 32x 3.5" Hot-swap SAS3/SATA3 drive bays and 4x NVMe hybrid drive bays (SAS3/SATA3/NVMe*); 2x 2.5" optional Hot-swap SATA drive bays (rear); 4x 2.5" internal fixed drive bays 6. SAS3 via Broadcom 3008 controller; IT mode 7. Server remote management: IPMI 2.0 / KVM over LAN / Media over LAN 8. 7x 80mm middle cooling fans 9. 1280W Redundant Power Supplies Platinum Level (94%)

1. Dual Socket P (LGA 3647) support 2nd Gen Intel® Xeon® Scalable processors (Cascade Lake/Skylake) 2. 12 DIMMs; up to 3TB 3DS ECC DDR4-2933MHz RDIMM/LRDIMM, Supports Intel® Optane™ DCPMM

1. Single socket P (LGA 3647) supports Intel® Xeon® Scalable Processors 2. Up to 1TB ECC 3DS LRDIMM, up to DDR4-2666MHz; 8 DIMM slots 3. 1 PCI-E 3.0 x16, 1 PCI-E 3.0 x8, 1 PCI-E 3.0 x8, 1 PCI-E 3.0 x4 (in x8) 4. 2x 10GBase-T with Intel® X557 5. 36 Hot-swap 3.5" SAS/SATA drive bays with SES3 (24 front + 12 rear); 4 Internal fixed 2.5" drive bays 2 Hot-swap 2.5" NVMe/SATA (rear, optional) 6. SAS3 via Broadcom 3008 controller 7. Server remote management: IPMI 2.0 / KVM over LAN / Media over LAN 8. 7 High-performance 8cm PWM fans 9. 1200W Redundant Power Supplies Titanium Level (96%)

1. Dual Node (HA), Enterprise High Availability (SBB) Architecture (shared storage); Fully serviceable and redundant Two hot-pluggable systems (nodes) in a 4U form factor. Each node supports the following: 2. Dual Socket P (LGA 3647) support 2nd Gen Intel® Xeon® Scalable processors (Cascade Lake/Skylake)‡ 3. 16 DIMMs; up to 4TB 3DS ECC DDR4-2933MHz† RDIMM/LRDIMM, Supports Intel® Optane™ DCPMM†† 4. 2 PCI-E 3.0 x16 (HHHL), 1 PCI-E 3.0 x8 (HHHL) 5. 90x 3.5"/2.5" Hot-swap SAS3 drives, 2x Fixed slim SATA SSD, 2x NVMe M.2 (form factor: 22110) 6. Dual Broadcom 3616 IT Mode 7. Server remote management: IPMI 2.0 / KVM over LAN / Media over LAN 8. 6x 8cm hot-swap counter-rotate redundant PWM cooling fans 9. 2600W Redundant Power Supplies Titanium Level (96%) 10. Dedicated node to node connectivity featuring high performance NTB PCI-E 3.0 x16 , 1G private Ethernet, and IPMI for robust node fail-over support

1. Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4†/ v3 family; QPI up to 9.6GT/s 2. Up to 2TB† ECC 3DS LRDIMM , up to DDR4- 2400†MHz ; 16 DIMM slots 3. 1 PCI-E 3.0 x16 HHHL slot, 1 PCI-E 3.0 x8 HHHL slot, 1 SIOM slot

1. Dual Socket P (LGA 3647) support Intel® Xeon® Scalable Processors 2. Up to 3TB 3DS ECC LRDIMM, up to DDR4-2666MHz; 24 DIMM slots 3. 2 PCI-E 3.0 x16 Low-profile slots 4. Dual Drawer/Tray with a total of 32 NVMe 2.5" SSDs 5. 2x 10GBase-T LAN ports 6. Built in Intel QAT for Crypto/Compression 7. 8x 40x56mm PWM fans 8. 1600W Redundant Power Supplies Platinum Level

Single Socket P+ (LGA-4189) 3rd Gen Intel® Xeon® Scalable processors. Up to 270W TDP. 8 DIMMs; Supports 3DS DDR4-3200: RDIMM/LRDIMM/Intel® DCPMM 2 PCI-E 4.0 x16 (LP) slots, 2 PCI-E 4.0 x8 (LP) slots Intel® Ethernet Controller X550 2x 10GbE RJ45 12x Direct-attached hot-swap 3.5" SAS3/SATA3 drive bays, Onboard 1x NVMe/SATA M.2; 2x Hot-swap 2.5" NVMe Gen 4/SATA (rear, optional) Redundant Titanium 800W Power Supply

1. Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4†/ v3 family; QPI up to 9.6GT/s 2. Up to 2TB† ECC 3DS LRDIMM , up to DDR4- 2400†MHz ; 16x DIMM slots 3. 1x PCI-E 3.0 x16, 6x PCI-E 3.0 x8 4. Dual 10GBase-T LAN w/ Intel® X540

1. Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4†/ v3 family; QPI up to 9.6GT/s 2. Up to 3TB† ECC 3DS LRDIMM , up to DDR4- 2400†MHz ; 24x DIMM slots 3. 2 PCI-E 3.0 x16, 1 PCI-E 3.0 x8 4. SIOM for flexible networking options

1. Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4†/ v3 family; QPI up to 9.6GT/s 2. Up to 3TB† ECC 3DS LRDIMM , up to DDR4- 2400†MHz ; 24 DIMM slots 3. 6 PCI-E 3.0 x8 slots (4 FH, 10.5" L, 1 LP, 1 Internal LP) 4. 4x 10GBase-T ports 5. 12 Hot-swap 3.5" Drive Bays: Default 4 NVMe ports; 12 SAS3 ports via Expander and AOC: AOC-S3108L-H8iR-16DD, AOC-S3108L-H8iR, AOC-S3008L-L8e, AOC-S3008L-L8i; Optional 2 hot-swap 2.5" rear drive bays for SSDs 6. 4 heavy duty fans w/ optimal fan speed control 7. 1000W High efficiency (96%) Redundant PSU; Titanium Level

1. Intel® Xeon® processor E5-2600 and E5-2600 v2 family† 2. Up to 512GB DDR3 1600MHz ECC Registered DIMM; 16x DIMM slots 3. 1 PCI-E 3.0 x16 & 4 PCI-E 3.0 x8 slots 4. Intel® x540 Dual 10GBase-T LAN 5. 24x 2.5" Hot-swap SAS2/SATA3 HDD Bays with direct attached backplane

1. Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4†/ v3 family; QPI up to 9.6GT/s 2. Up to 3TB† ECC 3DS LRDIMM , up to DDR4- 2400†MHz ; 24x DIMM slots 3. 2 PCI-E 3.0 x16, 3 PCI-E 3.0 x8