Storage Servers

1. Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4†/ v3 family; QPI up to 9.6GT/s 2. Up to 3TB† ECC 3DS LRDIMM , up to DDR4- 2400†MHz ; 24x DIMM slots 3. 3 PCI-E 3.0 x8 slots (2 FH 10.5" L, 1 LP) 4. 2x 10GBase-T ports

1. Single AMD EPYC™ 7000-Series Processor 2. Up to 2TB Registered ECC DDR4   2666MHz SDRAM in 16 DIMMs 3. Expansion slots:   1 PCI-E 3.0 x16 (FH/HL) slot   M.2 Interface: PCI-E 3.0 x4    (NVMe based)   M.2 Form Factor: 2280, 22110   M.2 Key: Onboard M-key   Number of M.2: Dual 4. Integrated IPMI 2.0 + KVM with   dedicated LAN 5. 2x 10GBase-T LAN ports   via Broadcom BCM57416 6. 24 hot-swap 2.5" U.2 NVMe drive bays 7. 1200W Redundant Power Supplies   Titanium Level (96%)

1. Dual Node (HA), Enterprise High Availability (SBB) Architecture (shared storage); Fully serviceable and redundant Two hot-pluggable systems (nodes) in a 4U form factor. Each node supports the following: 2. Dual Socket P (LGA 3647) support 2nd Gen Intel® Xeon® Scalable processors (Cascade Lake/Skylake)‡ 3. 16 DIMMs; up to 4TB 3DS ECC DDR4-2933MHz† RDIMM/LRDIMM, Supports Intel® Optane™ DCPMM†† 4. 2 PCI-E 3.0 x16 (HHHL), 1 PCI-E 3.0 x8 (HHHL) 5. 90x 3.5"/2.5" Hot-swap SAS3 drives, 2x Fixed slim SATA SSD, 2x NVMe M.2 (form factor: 22110) 6. Dual Broadcom 3616 IT Mode 7. Server remote management: IPMI 2.0 / KVM over LAN / Media over LAN 8. 6x 8cm hot-swap counter-rotate redundant PWM cooling fans 9. 2600W Redundant Power Supplies Titanium Level (96%) 10. Dedicated node to node connectivity featuring high performance NTB PCI-E 3.0 x16 , 1G private Ethernet, and IPMI for robust node fail-over support

1. Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4†/ v3 family (up to 160W TDP) 2. Up to 3TB† ECC 3DS LRDIMM , up to DDR4- 2400†MHz ; 24 DIMM slots 3. 2 PCI-E 3.0 x16, 1 PCI-E 3.0 x8 4. SIOM for flexible networking options 5. 45 Hot-swap 3.5" SAS3/SATA3 drive bays; 2 rear Hot-swap 2.5" SATA drive bays; optional 6 NVMe bays 6. Broadcom 3008 SAS3 IT mode controller 7. Server remote management: IPMI 2.0 / KVM over LAN / Media over LAN 8. 5 hot-swap 8cm redundant PWM fans PWM fans 9. 1600W Redundant Power Supplies Platinum Level (94%+) Certified 10. Front 3.5" LCD display

1. Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4†/ v3 family; QPI up to 9.6GT/s 2. Up to 1TB† ECC 3DS LRDIMM , up to DDR4- 2400†MHz ; 8x DIMM slots 3. SIOM card for multiple IO options 4. 90x 3.5" Hot-swap SAS3/SATA3 drive

Dual Socket E (LGA-4677) 5th/4th Gen Intel® Xeon® Scalable processors Up to 4TB 3DS ECC RDIMM, DDR5-5600MT/s(1DPC) in 16 DIMM slots 1x GbE Dedicated LAN for server remote management: IPMI 2.0 / KVM over LAN / Media over LAN 2x 10 GbE onboard via Broadcom BCM57416 36x 3.5"/2.5" Hot-swap SAS3/SATA3 drives, 2x Rear 2.5" SATA Slots, 2x NVMe M.2 (form factor: 2280 and 22110)

1. Intel® Xeon® processor E5-2600 and E5-2600 v2 family† 2. Up to 512GB DDR3 1600MHz ECC Registered DIMM; 16x DIMM slots 3. 1 PCI-E 3.0 x16 & 4 PCI-E 3.0 x8 slots 4. Intel® x540 Dual 10GBase-T LAN 5. 24x 2.5" Hot-swap SAS2/SATA3 HDD Bays with direct attached backplane

Single Socket P+ (LGA-4189) 3rd Gen Intel® Xeon® Scalable processors. Up to 270W TDP. 8 DIMMs; Supports 3DS DDR4-3200: RDIMM/LRDIMM/Intel® DCPMM 2 PCI-E 4.0 x16 (LP) slots, 2 PCI-E 4.0 x8 (LP) slots Intel® Ethernet Controller X550 2x 10GbE RJ45 12x Direct-attached hot-swap 3.5" SAS3/SATA3 drive bays, Onboard 1x NVMe/SATA M.2; 2x Hot-swap 2.5" NVMe Gen 4/SATA (rear, optional) Redundant Titanium 800W Power Supply

1. Dual Socket P+ (LGA-4189) 3rd Gen Intel® Xeon® Scalable Processors 2. 16 ECC DDR4-3200: LRDIMM/RDIMM + 2 Intel® Optane™ Persistent Memory Dedicated Slots 3. 2x 10Gbe 4. 16x 3.5" hot-swap hybrid SATA/SAS drive bays (4 NVMe Hybrid Ports); 2 Rear SATA 2.5" Slots; onboard 1 M.2 NVMe 5. 3 heavy duty fans with optimal fan speed control; 1 Air Shroud 6. 1600W Redundant Power Supplies Titanium Level (96%) 7. Broadcom® 3916 controller

Single Socket P+ (LGA-4189) 3rd Gen Intel® Xeon® Scalable processors. Up to 270W TDP. 8 DIMMs; Supports 3DS DDR4-3200: RDIMM/LRDIMM/Intel® DCPMM 2 PCI-E 4.0 x16 (LP) slots, 2 PCI-E 4.0 x8 (LP) slots Intel® Ethernet Controller X550 2x 10GbE RJ45 60x Top-loading hot-swap 3.5" or 2.5" SAS3/SATA3 drive bays, 2x Hot-swap 2.5" SATA drive bays (rear), Onboard 1x NVMe/SATA M.2; 2x Hot-swap 2.5" SATA3/NVMe (rear, optional) 5 Hot-Swap 8cm redundant PWM fans Redundant Titanium 1600W Power Supply

1. Dual socket P (LGA 3647) supports Intel® Xeon® Scalable Processors, 3 UPI up to 10.4GT/s 2. Up to 2TB ECC 3DS LRDIMM, up to DDR4-2666MHz; 16 DIMM slots 3. 3 PCI-E 3.0 x16, 4 PCI-E 3.0 x8 (slot 2 & 3 occupied by controller and JBOD expansion port)

1. Dual socket P (LGA 3647) supports Intel® Xeon® Scalable Processors, 3 UPI up to 10.4GT/s 2. Up to 3TB ECC 3DS LRDIMM, up to DDR4-2666MHz; 24 DIMM slots 3. 2 PCI-E 3.0 x16, 1 PCI-E 3.0 x8