Servers

1. 3 Socket LGA4677 5th Gen Intel® Xeon®/4th Gen Intel® Xeon Scalable processors 2. 24 DIMMs; Up to 6TB 3DS ECC DDR5-5600MT/s RDIMM/LRDIMM 3. 6 PCIe Gen5 x16 FHHL slot 3 PCIe Gen5 x16 HHHL slot 4. 6 NVMe M.2 2280/22110 5. 1+1 Redundant 2000W DC Power Supplies

32 DIMM slots Up to 8TB: 32x 256 GB DRAM Memory Type: 4800MHz ECC DDR5 8 PCIe Gen 5.0 X16 LP, 2 PCIe Gen 5.0 X16 FHFL Slots Flexible networking options 12x 2.5" Hot-swap NVMe drive bays 2 M.2 NVMe for boot drive only 8x 2.5" Hot-swap SATA drive bays 10 heavy duty fans with optimal fan speed control 6x 3000W (3+3) Redundant Power Supplies, Titanium Level Optional: 8x 3000W (4+4) Redundant Power Supplies, Titanium Level

1. Single socket H4 (LGA 1151) supports Intel® 7th/6th Gen. Core™ i7/i5/i3 series 2. Intel® Z270 Express Chipset 3. Up to 64GB Non-ECC UDIMM, DDR4-3733MHz (OC), in 4 DIMM slots 4. 4 PCI-E 3.0 x16 (run at 16/NA/16/NA, 8/8/8/8, Auto Switch), 1 PCI-E 3.0 x4 5. 2 PCIe 3.0 x4 M.2 (support 22110) 1 compatible w/ SATA; RAID 0, 1 support 6. 2 PCIe 3.0 x4 U.2 (1 share with M.2); RAID 0, 1 support 7. USB 3.1/3.0/2.0, 2 GbE LAN ports (1 via Intel i210-AT, 1 via Intel i219V) 8. Removable 3.5" and 2.5" HDD/SSD cages with tool-less trays for up to 10 drives; 2x 5.25" Peripheral Drive Bays 9. 1 DP (Display Port), 1 HDMI 10. HD Audio 7.1 channel connector by Realtek ALC1150, support SPDIF-Out 11. 750W Multi-output ATX Power Supply with modular cable; 80Plus Gold

Single Intel® Quark™ SoC X1021, CPU TDP support 2.2W, 1x Micro SDHC up to 32GB internal slot, Onboard 512MB DDR3 ECC memory, Expansion slots: 2x Mini-PCI-E slots, 1x ZigBee module socket

1. Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4†/ v3 family; QPI up to 9.6GT/s 2. Up to 1TB† ECC 3DS LRDIMM , up to DDR4- 2400†MHz ; 8x DIMM slots 3. 1x PCI-E 3.0 x8 (FHHL) slot 4. 4x 3.5" Hot-swap SATA3 Drive Bays

1. Single Intel® Quark™ SoC X1021; CPU TDP support 2.2W 2. 1x Micro SDHC up to 32GB internal slot 3. Onboard 512MB DDR3 ECC memory 4. Expansion slots: 2x Mini-PCI-E slots, 1x ZigBee module socket 5. I/O ports: TPM 1.2 onboard Chip

1. Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4†/ v3 family; QPI up to 9.6GT/s 2. Up to 2TB† ECC 3DS LRDIMM , up to DDR4- 2400†MHz ; 16x DIMM slots 3. 1 PCI-E 3.0 x16, 6 PCI-E 3.0 x8