Rackmounts

Powered by dual-socket 3rd Gen Intel Scalable processors, 32 DIMMs and support for a maximum TDP of up to 270 W per socket Up to four all-flash NVMe, four NVMe/SATA/SAS and four SATA/SAS drives on front panel, plus 2 optional NVMe in rear panel High power efficiency with redundant 2400W/1600W 80 Plus® Platinum power supplies

2nd Gen Intel® Xeon® Scalable and Intel® Xeon® Scalable Processors Dual processor, LGA 3647 6-Channel RDIMM/LRDIMM DDR4, 16 x DIMMs Dual 1Gb/s LAN port (Intel® I210-AT) 1 x Dedicated management port 4 x 3.5"/2.5" SATA hot-swappable bays 1 x 2.5" SATA Internal fixed bay 2 x 2.5" SATA Internal fixed bays (optional)

4th Gen Intel® Xeon® Scalable Processors Intel® Xeon® CPU Max Series Dual processor, LGA 4677 8-Channel RDIMM DDR5 per processor, 32 x DIMMs Dual ROM Architecture supported 2 x 1Gb/s LAN ports (Intel® I350-AM2) 1 x Dedicated management port 12 x 3.5"/2.5" Gen4 NVMe/SATA hot-swappable bays 2 x 2.5" SATA hot-swappable bays on rear side

1. Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4†/ v3 family; QPI up to 9.6GT/s 2. Up to 3TB† ECC 3DS LRDIMM , up to DDR4- 2400†MHz ; 24 DIMM slots 3. 6 PCI-E 3.0 x8 slots (4 FH, 10.5" L, 1 LP, 1 Internal LP) 4. 4x 10GBase-T ports 5. 12 Hot-swap 3.5" Drive Bays: Default 4 NVMe ports; 12 SAS3 ports via Expander and AOC: AOC-S3108L-H8iR-16DD, AOC-S3108L-H8iR, AOC-S3008L-L8e, AOC-S3008L-L8i; Optional 2 hot-swap 2.5" rear drive bays for SSDs 6. 4 heavy duty fans w/ optimal fan speed control 7. 1000W High efficiency (96%) Redundant PSU; Titanium Level