Rackmounts

1. Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4†/ v3 family; QPI up to 9.6GT/s 2. Up to 3TB† ECC 3DS LRDIMM , up to DDR4- 2400†MHz ; 24 DIMM slots 3. 6 PCI-E 3.0 x8 slots (4 FH, 10.5" L, 1 LP, 1 Internal LP) 4. 4x 10GBase-T ports

Single Socket P+ (LGA-4189) 3rd Gen Intel® Xeon® Scalable processors. Up to 220W TDP. 8 DIMMs; Supports 3DS DDR4-3200: RDIMM/LRDIMM/Intel® DCPMM 1 PCI-E 4.0 x16 (FHHL) slot Intel® Ethernet Controller i350 2x 1GbE RJ45 4x hot-swap 3.5'' Hybrid SATA3/NVMe drive bays, SAS3 with additional SAS controller card; Onboard 2x NVMe/SATA M.2 Single Platinum 500W Power Supply

1. Intel® Xeon® D-2146NT Processor, 8-Core, 16 Threads, 2.3 GHz, 80W 2. Up to 512GB ECC LRDIMM, up to 256GB reg. ECC RDIMM DDR4-2133Mz; in 4 DIMM slots 3. 2 PCI-E 3.0 x16 (FHFL) slots 4. 2 Hot-swap 2.5" drive bays, 2 Internal 2.5" SSD bays 5. 3 M.2: M-Key SATA/PCI-E 3.0 x4, 22110 E-Key PCI-E 3.0 x1, 2230 B-Key SATA/PCI-E 3.0 x2/USB 3.0, 2242

The HPE ProLiant DL325 Gen11 server is a low-cost 1U 1P solution that delivers exceptional value balancing compute, memory and network bandwidth at 1P economics. Powered by 4th Generation AMD EPYC™ Processors with up to 128 cores, increased memory bandwidth (up to 3 TB), high-speed PCIe Gen5 I/O and EDSFF storage, and supporting up to two GPUs at the front1, this server is a superb low-cost, 1U 1P, performance solution for your virtualized workloads. The silicon root of trust anchors the server firmware, creating a fingerprint for the AMD Secure Processor that must be matched exactly before the server will boot. The HPE ProLiant DL325 Gen11 server is an excellent choice for virtualized workloads such as software-defined compute, CDN, VDI, and secure edge apps that require balancing processor, memory, and network bandwidth.

1. Single Socket H4 (LGA 1151) supports Intel® Xeon® processor E-2100 / E-2200 series, 8th Gen. Intel® Core™ i3 Processors, Intel® Celeron®, Intel® Pentium® 2. Intel® C246 chipset 3. Up to 128GB unbuffered ECC UDIMM, DDR4-2666MHz; 4 DIMM slots 4. 1 PCI-E 3.0 x16 (FHFL) slot

1. Dual socket R (LGA 2011) supports Intel® Xeon® processor E5-2600 2. Up to 1.5TB ECC DDR3 up to 1866MHz; 24x DIMM slots 3. 1x PCI-E 3.0 x16 FHHL 4. Intel® X540 Dual port 10GBase-T 5. 4x 3.5" Hot-swap SATA HDD Bays 6. 600W High-efficiency power supply

1. Octa Socket P (LGA 3647) support Intel® Xeon® Scalable Processors 2. Up to 12TB 3DS ECC LRDIMM, up to DDR4-2666MHz; 96 DIMM slots 3. 23 or 39 (OEM) PCI-E 3.0 slots include: 8 FH x16 PCI-E cards or 8 GPUs or 16 U.2 NVMe + 8 FHFL x16 PCI-E cards or 16 U.2 NVMe + 8 FHFL x16 PCI-E cards or 16 U.2 NVMe + 2 LP x8 (in x16) PCI-E internal cards (storage module) + 5 FHHL x16 PCI-E cards (rear)(Up to 39 PCI-E 3.0 slots for OEM) 4. 4 10Gb LAN (SIOM), 1 dedicated LAN for IPMI Remote Management, 1 VGA, 2 USB 2.0, 1 COM via KVM 5. 16 Hot-swap 2.5" SAS3 drive bays (w/ RAID cards); 8x 2.5" or 6x 3.5" internal drive bays (w/ RAID cards) 6. 8x 9cm Hot-swap counter-rotating rear fans 7. 5x 1600W (N+2) Redundant Power Supplies, Titanium Level (96%)

1.Dual AMD EPYC™ 7002 Series Processors 2.8TB Registered ECC DDR4 3200MHz SDRAM in 32 DIMMs 3.Expansion slots: 2 PCI-E 4.0 x16 (FH, 10.5" L) slots, 1 PCI-E 4.0 x16 (FH, 9.5" L) slot, 1 PCI-E 4.0 x16 (LP) slot, 1 PCI-E 4.0 x8 (FH, 9.5" L, in x16) slot, 1 PCI-E 4.0 x8 (internal LP in x16) slot 4.Integrated IPMI 2.0 + KVM with dedicated LAN • Software Out of Band License  key (SFT-OOB-LIC) included  for OOB BIOS management 5.Dual 10GBase-T LAN ports via Intel® X710-AT2 6.12 hot-swap 3.5" Drive Bays:  12 SATA3 by default  or 8 SATA3 + 4 NVMe via optional tray  or 12 SAS3 via optional SAS kit 7.1600W Redundant Power Supplies Titanium Level (96%+)

Single-Socket, 3rd Gen Intel® Xeon® Scalable processors up to 270W TDP, Intel® C621A, Up to 16 DIMM Slots or 4TB (with Intel® Optane™ Persistent Memory support), Optional: AIOM PCI-E 4.0 x16 LP (OCP 3.0 compliant)

1. Dual socket R (LGA 2011) supports Intel® Xeon® processor E5-2600 and E5-2600 v2 family† 2. Up to 1.5TB ECC DDR3, up to 1866MHz; 24x DIMM slots 3. 4x PCI-E 3.0 x16 (low-profile) 1x PCI-E 3.0 x8 (low-profile) 1x PCI-E 3.0 x4 (in x8)

1. Single Socket H4 (LGA 1151) supports Intel® Xeon® processor E-2100 / E-2200 series, 8th/9th Gen. Intel® Core™ i3 Processors, Intel® Celeron®, Intel® Pentium® 2. Intel® C242 chipset 3. Up to 64GB ECC UDIMM, up to DDR4-2666MHz; 2 DIMM slots 4. 1 PCI-E 3.0 x16 slot 5. 2 Fixed 3.5" drive bay or 4 Fixed 2.5" drive bays 6. M.2 Interface: 1 SATA/PCI-E 3.0 x4 M.2 Form Factor: 2280 M.2 Key: M-Key 7. 2 GbE LAN ports, 1 dedicated IPMI LAN 8. 2 USB 3.1 (front), 2 USB 2.0 (front) 9. 1 VGA, 1 COM, 1 TPM 10. 200W Multi-output power supply, Gold Level Certified

HPE PL DL380g10 4210R (2.4G/10C) 1x32G MR416i-p/4G 8SFFBC 1x800Wtit 4x1GFLR EIR+CMA NBD333 2U*