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Servers GIGABYTE Builds High Density Servers GIGABYTE H374-A80 (rev. LAW1) - 6NH374A80DR000LAW1

GIGABYTE H374-A80 (rev. LAW1) - 6NH374A80DR000LAW1

Direct liquid cooling solution with leak detection 3U 4-node rear access server system Dual Intel® Xeon® 6900-Series Processors per node 12-Channel DDR5 RDIMM / MRDIMM, 24 x DIMMs per node Dual ROM Architecture 8 x 1Gb/s LAN ports via Intel® I350-AM2 24 x 2.5" Gen5 NVMe/SATA/SAS-4 hot-swap bays 12 x LP PCIe Gen5 x16 slots 4 x LP PCIe Gen5 x16 slots (optional) Triple 3000W 80 PLUS Titanium redundant power supply

We also offer six months of free collocation in our TIER III data center.

Components are not the end — ask us for a custom server configuration. We will design the server, assemble it, expertly set it up, and provide extended or NBD warranty.

Product code 202.181468
Part number 6NH374A80DR000LAW1
Manufacturer GIGABYTE
Availability On demand
Warranty 36 months
Weight 40 kg
$ 16,555.39
pc

  1. Server system integrator & worldwide shipping
  2. Personal approach and tailor-made servers
  3. NBD warranties & cross-shipping
  4. Private cloud infrastructure
  5. Pre-sales & After-sales support


Detailed information

Rack servers

Highly flexible, scalable rack servers optimized for demanding applications in data centers. Rack density from 1U to 5U, servers are designed for single and multi-socket varieties of x86 processors from AMD and Intel as well as for ARM processors from Ampere.

Applications Include

Big Data

High Performance Computing (HPC)

Hyper-converged infrastructure (HCI)

Software-defined Storage (SDS)

Virtualization

Only the best with GIGABYTE

Strong R&D and forward ideas to deliver the values that can help you succeed in the future.

High Performance

Servers and motherboards by GIGABYTE are tested to ensure peak performance for demanding CPU workloads. All the latest technology is supported.

Compute Density

One single socket solution can outperform many dual CPU servers. Dual socket models also support up to hundreds of cores in a 1U-5U chassis. More compact performance.

Fast & Stable Connectivity

Keeping pace with the challenges for next gen technology, well designed GIGABYTE boards provide users the signal integrity for newest PCIe generation.

Modularity

Building block designs allow new models to quickly reach the market. Users can now have BMC on a OCP module customized by GIGABYTE.

Collaboration

GIGABYTE and its partners have maintained a healthy relationship that values shared knowledge in order to get the latest technology into data centers.

Optimal Price

A broad portfolio of servers and products allows customers to only select the features they require which results in a lower total cost of ownership (TCO).

High Density

Multi-node servers enhance performance by distributing workloads across nodes, ensuring reliability and scalability. Key benefits include redundancy, simplified management, lower TCO, and improved efficiency.

Dimensions
Form Factor 3U 4-Node - Rear access
Server Dimensions( WxHxD ) 447 x 130.5 x 900 mm
Packaging Dimensions 1184 x 706 x 425
Motherboard
Part Name MA84-HD0
Processor
CPU Intel® Xeon® 6 Processors
- Intel® Xeon® 6900-Series Processors
Socket LGA 7529
QTY 8
Chipset System on Chip
System Memory
Memory Type DDR5
RDIMM
Memory Speed RDIMM: Up to 6400 MT/s
MRDIMM: Up to 8800 MT/s
Memory Slots 96
Storage
Disk Bays Front hot-swap:
24 x 2.5" Gen5 NVMe/SATA/SAS-4
- (NVMe from CPU_1)

Storage card is required to support SATA and SAS drives.
Input / Output
LAN 8 x 1Gb/s LAN (4 x Intel® I350-AM2)
- Support NCSI function

4 x 10/100/1000 Mbps Management LAN
Video 4 x Mini-DP
PCIe Expansion Slots
PCIe Cable x 8 8 x LP x16 (Gen5 x16), from CPU_1
Riser Card CRCH010 x 8 4 x LP x16 (Gen5 x16), from CPU_0
4 x LP x16 (Gen5 x16), from CPU_0
Backplane Board
Backplane Board PCIe Gen5 x4 or SATA 6Gb/s or SAS-4 24Gb/s
Security Modules
TPM 4 x TPM headers with SPI interface
- Optional TPM2.0 kit: CTM012
PRoT 4 x PRoT connectors (only enabled on RoT SKU)
Power Supply
Certification 80 PLUS Titanium
Power 3000W
QTY 3

Parameters

Size in U 3
Depth (mm) 900
CPU manufacturer Intel
Socket 7529
HDD disks 24
2.5" Drive bays 24
3.5" Drive bays 0
NVMe slots 24
Total amount of PCIe 16
OCP/AIOM 0
Power (W) 3000
Efficiency certification Titanium

Price development



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