GIGABYTE H374-A80 (rev. LAW1) - 6NH374A80DZ000LAW1
Direct liquid cooling solution with leak detection 3U 4-node rear access server system Dual Intel® Xeon® 6900-Series Processors per node 12-Channel DDR5 RDIMM / MRDIMM, 24 x DIMMs per node Dual ROM Architecture 8 x 1Gb/s LAN ports via Intel® I350-AM2 24 x 2.5" Gen5 NVMe/SATA/SAS-4 hot-swap bays 12 x LP PCIe Gen5 x16 slots 4 x LP PCIe Gen5 x16 slots (optional) Triple 3000W 80 PLUS Titanium redundant power supply
We also offer six months of free collocation in our TIER III data center.
Components are not the end — ask us for a custom server configuration. We will design the server, assemble it, expertly set it up, and provide extended or NBD warranty.
| Product code | 202.181438 |
|---|---|
| Part number | 6NH374A80DZ000LAW1 |
| Manufacturer | GIGABYTE |
| Availability | On demand |
| Warranty | 36 months |
| Weight | 40 kg |
Server system integrator & worldwide shipping
Personal approach and tailor-made servers
NBD warranties & cross-shipping
Private cloud infrastructure
Pre-sales & After-sales support
Detailed information
Rack servers
Highly flexible, scalable rack servers optimized for demanding applications in data centers. Rack density from 1U to 5U, servers are designed for single and multi-socket varieties of x86 processors from AMD and Intel as well as for ARM processors from Ampere.
Applications Include
Big Data
High Performance Computing (HPC)
Hyper-converged infrastructure (HCI)
Software-defined Storage (SDS)
Virtualization
Only the best with GIGABYTE
Strong R&D and forward ideas to deliver the values that can help you succeed in the future.
High Performance
Servers and motherboards by GIGABYTE are tested to ensure peak performance for demanding CPU workloads. All the latest technology is supported.
Compute Density
One single socket solution can outperform many dual CPU servers. Dual socket models also support up to hundreds of cores in a 1U-5U chassis. More compact performance.
Fast & Stable Connectivity
Keeping pace with the challenges for next gen technology, well designed GIGABYTE boards provide users the signal integrity for newest PCIe generation.
Modularity
Building block designs allow new models to quickly reach the market. Users can now have BMC on a OCP module customized by GIGABYTE.
Collaboration
GIGABYTE and its partners have maintained a healthy relationship that values shared knowledge in order to get the latest technology into data centers.
Optimal Price
A broad portfolio of servers and products allows customers to only select the features they require which results in a lower total cost of ownership (TCO).
High Density
Multi-node servers enhance performance by distributing workloads across nodes, ensuring reliability and scalability. Key benefits include redundancy, simplified management, lower TCO, and improved efficiency.
| Dimensions | |
| Form Factor | 3U 4-Node - Rear access |
| Server Dimensions( WxHxD ) | 447 x 130.5 x 900 mm |
| Packaging Dimensions | 1184 x 706 x 425 |
| Motherboard | |
| Part Name | MA84-HD0 |
| Processor | |
| CPU | Intel® Xeon® 6 Processors - Intel® Xeon® 6900-Series Processors |
| Socket | LGA 7529 |
| QTY | 8 |
| Chipset | System on Chip |
| System Memory | |
| Memory Type | RDIMM DDR5 |
| Memory Speed | RDIMM: Up to 6400 MT/s MRDIMM: Up to 8800 MT/s |
| Memory Slots | 96 |
| Storage | |
| Disk Bays | Front hot-swap: 24 x 2.5" Gen5 NVMe/SATA/SAS-4 - (NVMe from CPU_1) Storage card is required to support SATA and SAS drives. |
| Input / Output | |
| LAN | Rear (I/O board - CLNP319 x 4): 8 x 1Gb/s LAN (4 x Intel® I350-AM2) - Support NCSI function 4 x 10/100/1000 Mbps Management LAN |
| Video | 4 x Mini-DP |
| PCIe Expansion Slots | |
| PCIe Cable x 8 | 8 x LP x16 (Gen5 x16), from CPU_1 |
| Riser Card CRCH010 x 8 | 4 x LP x16 (Gen5 x16), from CPU_0 4 x LP x16 (Gen5 x16), from CPU_0 (Enabling the slots requires specific cold plate loops and tubes relocation. Please contact our sales representatives if the feature is needed.) |
| Backplane Board | |
| Backplane Board | PCIe Gen5 x4 or SATA 6Gb/s or SAS-4 24Gb/s |
| Security Modules | |
| TPM | 4 x TPM headers with SPI interface - Optional TPM2.0 kit: CTM012 |
| PRoT | 4 x PRoT connectors (only enabled on RoT SKU) |
| Power Supply | |
| Certification | 80 PLUS Titanium |
| Power | 3000W |
| QTY | 3 |
Parameters
| Size in U | 3 |
|---|---|
| Depth (mm) | 900 |
| CPU manufacturer | Intel |
| Socket | 7529 |
| HDD disks | 24 |
| 2.5" Drive bays | 24 |
| 3.5" Drive bays | 0 |
| NVMe slots | 24 |
| Total amount of PCIe | 16 |
| OCP/AIOM | 0 |
| Power (W) | 3000 |
| Efficiency certification | Titanium |
