Workstations

1. Single Socket P (LGA 3647) support 2nd Gen Intel® Xeon® Scalable processors (Cascade Lake/Skylake)‡ Intel® Xeon® W-32xx processor 2. Intel® Xeon® Scalable Processors: Up to 3TB 3DS ECC RDIMM, DDR4-2933MHz; up to 2TB 3DS ECC LRDIMM, DDR4-2933MHz; or 3TB DCPMM, DDR4-2666MHz, in 12 DIMM slots. Intel® Xeon® W-3200 Processors: Up to 2TB 3DS ECC L/RDIMM; up to 1TB 3DS L/RDIMM. (Xeon® W-3200 doesn't support DCPMM.) 3. 4 PCI-E 3.0 x16, 3 PCI-E 3.0 x8 (in x16 slot) M.2 Interface: 4 PCI-E 3.0 x4, RAID 0, 1 M.2 Form Factor: 2242/2260/2280/22110 M.2 Key: M-Key 4. 1x 10GBase-T and 1x 1GbE LAN ports 5. 8 Hot-swap 3.5" SAS/SATA bay with SGPIO 6. 1 VGA port, VGA connector is dedicated for IPMI 7. 7.1 HD Audio 8. 2200W Redundant Power Supplies Titanium Level Certified

1. Dual socket P (LGA 3647) supports Intel® Xeon® Scalable Processors, 3 UPI up to 10.4GT/s 2. Up to 3TB ECC 3DS LRDIMM, up to DDR4-2666MHz; 24 DIMM slots 3. 2 PCI-E 3.0 x16, 1 PCI-E 3.0 x8 4. 60 Hot-swap 3.5" SAS3/SATA3 drive bays with SES3; 2 rear Hot-swap 2.5" drive bays 5. Broadcom 3008 SAS3, IT mode 6. Server remote management: IPMI 2.0 / KVM over LAN / Media over LAN 7. 5 Hot-swap 8cm rear exhaust PWM fans 8. 2000W Redundant Power Supplies Titanium Level (96%)

1. Dual socket P (LGA 3647) supports Intel® Xeon® Scalable Processors, 3 UPI up to 10.4GT/s 2. Up to 3TB ECC 3DS LRDIMM, up to DDR4-2666MHz; 24 DIMM slots 3. 2 PCI-E 3.0 x16, 1 PCI-E 3.0 x8

1. Dual socket P (LGA 3647) supports Intel® Xeon® Scalable Processors, 3 UPI up to 10.4GT/s 2. Up to 3TB ECC 3DS LRDIMM, up to DDR4-2666MHz; 24 DIMM slots 3. 4 PCI-E 3.0 x16 (LP) (GPU tray for GPUDirect RDMA), 2 PCI-E 3.0 x16 (LP, CPU tray) 4. Support 8 Tesla V100 with 300GB/s NVLINK 5. Dual 10GBase-T LAN with Intel® X540 6. 16 Hot-swap 2.5" SAS/SATA drives (Optional 8x NVMe drives supported), 2 NVMe based M.2 SSD 7. 8x 92mm cooling fans 8. 2200W Redundant (2+2) Power Supplies; Titanium Level (96%+)

1. Dual socket P (LGA 3647) supports Intel® Xeon® Scalable Processors, Dual UPI up to 10.4GT/s 2. Up to 1.5TB ECC 3DS LRDIMM, up to DDR4-2666MHz; 12 DIMM slots 3. 1 PCI-E 3.0 x16, 1 PCI-E 3.0 x8 (LP), 1 PCI-E 3.0 x16 (for SIOM ) 4. 2 Fixed 3.5" SATA3 drive bays M.2 Interface: PCI-E 3.0 x4 M.2 Form Factor: 2260, 2280, 22110 M.2 Key: M-Key 5. Dual GbE ports via SIOM Network card, 1 dedicated IPMI LAN port (front) 6. 1 VGA, 2 USB 3.0 ports (front) 7. 8x 8cm 13.5k RPM rear fans per enclosure 8. 2200W Redundant Power Supplies Titanium Level (96% Efficiency)

1. Single socket H3 (LGA 1150) supports Intel® Xeon® E3-1200 v3, 4th gen. Core i7/i5/i3, Pentium, Celeron processors 2. 4x 3.5" Hot-swap drive bays, 2x 2.5" fixed drive bays 3. 1x PCI-E 3.0 x16 slot, 1x Mini-PCIe with mSATA support

1. Single socket H4 (LGA 1151) supports Intel® 7th/6th Gen. Core i7/i5/i3 series, Intel® Celeron® and Intel® Pentium® processors 2. 4 Hot-swap 3.5" drive bays, 2 fixed 2.5" drive bays, support total of 5 hard drives 3. 1 PCI-E 3.0 x16 slot, 1 Mini-PCIe with mSATA support, 1 M.2 (M key 2242/2280 PCI-E 3.0 x4)

1. Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4†/ v3 family; QPI up to 9.6GT/s 2. Up to 1TB† ECC 3DS LRDIMM , up to DDR4- 2400†MHz ; 8x DIMM slots

CPU: Intel Xeon E-2334 (3.4 GHz) Network controler: Intel I210 (1 GbE) RAM: 16GB - DDR4 SDRAM 3200MHz Power suply: 500W 80PLUS

1. Single socket H4 (LGA 1151) supports Intel® Xeon® processor E-2100 / E-2200 series, 8th Gen. Intel® Core™ i3 Processors, Intel® Celeron®, Intel® Pentium® 2. Intel® C242 chipset 3. Up to 64GB ECC UDIMM, up to DDR4-2666MHz; 2 DIMM slots 4. 1 PCI-E 3.0 x16 slot (for LP AOC)

Intel® Xeon® E-2300 processors, Up to 128GB DDR4 RAM, High capacity, secure storage, Up to 24x storage devices, Ideal for standard small & medium business workloads

Intel® Xeon® W processors, Up to NVIDIA RTX™ A6000 or AMD Radeon™ Pro WX 3200, Ideal for high-end CAD, M&E, rendering and simulation applications, Supports NVIDIA® NVLink™ technology