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Servers Supermicro builds Rackmounts IoT Rack Supermicro SYS-221HE-TNR

Supermicro SYS-221HE-TNR

Supermicro SYS-221HE-TNR

Dual Socket E (LGA-4677) 4th Gen Intel® Xeon® Scalable processors 32 DIMM Slots; Up to 8TB: 32x 256GB DRAM Configurable PCIe slot options up to 8 PCIe 5.0 x8 (6 FHFL+ 2 FHHL) or 4 PCIe 5.0 x16 (3 FHFL + 1 FHHL) Flexible networking options with 2 AIOM networking slots (OCP NIC 3.0 compatible) Up to 6x 2.5" hot-swap drive bays with options to support NVMe/SATA drives 6 heavy duty hot-swap fans with optimal fan speed control Redundant 2000W AC power supplies

We also offer six months of free collocation in our TIER III data center.

Components are not the end — ask us for a custom server configuration. We will design the server, assemble it, expertly set it up, and provide extended or NBD warranty.

Product code 202.165980
Part number SYS-221HE-TNR
Manufacturer Supermicro
Availability Not in stock
Warranty 24 months
Weight 30 kg
The price includes all legal fees
$ 3,729.45
pc
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  1. Parameters

Detailed information

Complete System Only: To maintain quality and integrity, this product is sold only as a completely-assembled system (with minimum 2 CPUs, 4 DIMMs, 1 NIC adapter*, and 1 drive). *NIC adapter requirement includes either 1 AIOM networking card or 1 standard PCIe NIC adapter.*For only 1 CPU installed customer request, please contact PM.

 
Motherboard
Super X13DEM
Processor
CPU
  • Dual Socket E (LGA-4677)
  • 4th Gen Intel® Xeon® Scalable processors
Note
  • Supports up to 350W TDP CPUs (Air Cooled)
System Memory
Memory
  • Memory Capacity: 32 DIMM slots
  • Up to 8TB: 32x 256 GB DRAM
  • Memory Type: 4800MHz ECC DDR5 RDIMM
Memory Voltage
  • 1.1 V
Error Detection
  • ECC
On-Board Devices
SATA
  • SATA3 (6Gbps); RAID 0/1/5/10 support
NVMe
  • NVMe; RAID 0/1/5/10 support (Intel® VROC RAID Key required)
Chipset
  • Intel® C741
Network Connectivity
  • 2x 25GbE SFP28 with Broadcom® BCM57414 (optional)
  • 2x 100GbE QSFP28 with Broadcom® BCM57508 (optional)
  • 2x 100GbE QSFP28 with Intel® E810-CAM2 (optional)
  • 2x 100GbE QSFP28 with Mellanox® CX-6 DX (optional)
  • 4x 10GbE SFP+ with Intel® X710-BM2 (optional)
  • 4x 10GbE BaseT with Intel® X550 (optional)
IPMI
  • Support for Intelligent Platform Management Interface v.2.0
  • IPMI 2.0 with virtual media over LAN and KVM-over-LAN support
Input / Output
LAN
  • 1 RJ45 Dedicated BMC LAN port
USB
  • 2 USB 2.0 port(s) (2 front)
Video
  • 1 VGA port(s)
System BIOS
BIOS Type
  • AMI 256MB SPI Flash
Management
Software
Power Configurations
  • ACPI Power Management
  • Power-on mode for AC power recovery
Security
Hardware
  • Trusted Platform Module (TPM) 2.0
  • Silicon Root of Trust (RoT) – NIST 800-193 Compliant
Features
  • Cryptographically Signed Firmware
  • Secure Boot
  • Secure Firmware Updates
  • Automatic Firmware Recovery
  • Supply Chain Security: Remote Attestation
  • Runtime BMC Protections
  • System Lockdown
PC Health Monitoring
CPU
  • Monitors for CPU Cores, Chipset Voltages, Memory
FAN
  • Fans with tachometer monitoring
  • Pulse Width Modulated (PWM) fan connectors
  • Status monitor for speed control
Temperature
  • Monitoring for CPU and chassis environment
  • Thermal Control for fan connectors
 
Chassis
Form Factor
  • 2U Rackmount
Model
  • CSE-HE211-R000NFP
Note
  • Standard sliding rail kit: Post to Post 19.1" ~ 26.4“
Dimensions and Weight
Height
  • 3.5" (88.9mm)
Width
  • 17.2" (436.88mm)
Depth
  • 22.6" (574mm)
Package
  • 9.7" (H) x 23.5" (W) x 36.9" (D)
  •  
Weight
  • Net Weight: 34.4 lbs (15.6 kg)
  • Gross Weight: 47.4 lbs (21.5 kg)
Available Color
  • Silver
Front Panel
Buttons
  • Power On/Off 
LEDs
  • LAN1 activity
  • LAN2 activity
  • System information
Expansion Slots
PCI-Express (PCIe)
  • 6 PCIe 5.0 x16 FHFL slot(s)
  • 2 PCIe 5.0 x16 FHHL slot(s)
Note
  • If Slot 1 is configured as PCIe x16, Slot 2 will be disabled; If Slot 3 is configured as PCIe x16, Slot 4 will be disabled; If Slot 5 is configured as PCIe x16, Slot 6 will be disabled; (Optional) If Slot 7 is configured as PCIe x16, Slot 8 will be disabled.
Drive Bays / Storage
Hot-swap
  • 6x 2.5" hot-swap NVMe/SATA/SAS drive bays (6x 2.5" NVMe hybrid)
M.2
  • 2 M.2 NVMe OR 2 M.2 SATA3
  • M-Key, 2280/22110
System Cooling
Fans
  • 6 Counter-rotating, Hot-swappable 6cm Fan(s)
Power Supply
2000W Redundant Titanium Level power supplies
Certification Titanium Level94%+   Titanium Level

 

  [ Test Report ]
Operating Environment
Environmental Spec.
  • Operating Temperature:
       5°C ~ 35°C (41°F ~ 95°F)
  • Non-operating Temperature:
       -40°C to 70°C (-40°F to 158°F)
  • Operating Relative Humidity:
       8% to 90% (non-condensing)
  • Non-operating Relative Humidity:
       5% to 95% (non-condensing)

 
Standard Parts (Parts Included)
  Part Number Qty Description
Motherboard / Chassis MBD-X13DEM
 
 
CSE-HE211-R000NFP		 1
 
 
1		 Super X13DEM Motherboard
 
 
2U Chassis
Add-on Card / Module AOM-HE211-AIOM-X13-P 1 AIOM extension board for Hyper-E 2U, X13 MB,RoHS
AOM-HS119-IO-P 1 Hyper IO Board,RoHS
Backplane BPN-NVME5-HE211N-S6 1 1U 6-port all hybrids backplane support up to 6x SAS3/SATA3/NVME5 storage devices
Cable CBL-CDAT-1062 1 PicoBlade 1.25, 1x4 to 1x4,SB,45cm,3x 26AWG,RoHS
CBL-SAST-1243LP-85 1 SlimlineLP x8 (STR to STR),INT,30CM,85 OHM,RoHS
CBL-SAST-1249LP-85 1 SlimlineLP x8 (STR) tp 2x SlimlineLP x4 (STR),49/61CM,8
CBL-PWEX-1142-40 1 MicroHi,(2x4 to 2x4),PH3.0,40CM,8A/pin,18AWG,RoHS
CBL-PWEX-1142B-40 1 MicroHi(2x4 to 2x4), PH3.0, 40cm, 8.5A/p, 18AWG, RoHS
CBL-CDAT-1290F 1 [NR] FRONT CNTL,20 TO 20 PIN,P0.5,FLAT,90CM,STD,RoHS
CBL-PWCD-0160-IS 2 PWCD,US,NEMA5-15P TO IEC60320 C13,6FT,16AWG,RoHS/REACH
CBL-PWEX-1104-8 1 [NR] 2x4,PH3.0,M to 2x3,PH2.0,F,3A/pin,22AWG,8CM
Fan FAN-0224L4 6 60x60x56 mm, 17K-17K RPM, Counter-rotating Cooling Fan for Hyper-E Rear I/O Series Servers
Air Shroud MCP-310-21106-0B 4 HE211 Mylar air shroud for X12DHM 8-Barlow Pass Memory,RoHS
Power Supply PWS-2K08A-1R2 2 1U CRPS 2000W Titanium forward airflow, W73.5xL203xH40mm,
Heatsink / Retention SNK-P0088PR 2 2U Proprietary Passive CPU Heat Sink for X13 Generation Hyper-E Series Servers
*Front Panel FPB-FP826-T 1 Chassis front control board for SC826
*Drive Tray(s) MCP-220-00178-0B 6 2.5 thin profile drive tray, Orange tab (for hotswap NVMe drive), for SC119UH
Notes:
  1. Parts with * are inside the chassis
  2. Excessive parts might not be shipped, including but not limited to excessive drive trays, fans, riser brackets, air shrouds, IO shields, cables.....etc.

Parameters

OCP/AIOM 1
Total amount of PCIe 8
CPU manufacturer Intel
Depth (mm) 574
2.5" Drive bays 6
3.5" Drive bays 0
HDD disks 8
NVMe slots 2
Socket 4677
Efficiency certification Titanium
Size in U 2
Power (W) 2000

Price development



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  1. The only Supermicro integrator in Czechia, Slovakia and Poland
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