Storage Servers

1. 140 CPUs per 42U Rack 2. Dual socket P (LGA 3647) supports Intel® Xeon® Scalable Processors 3. Intel® C622 chipset 4. 3 Hot-plug 2.5" NVMe or 3 Hot-plug SATA3 drive bays 5. Intel® C622; RAID 0, 1, 5 6. 24 DDR4 LRDIMM/RDIMM slots 7. Dual 10G onboard 8. IPMI 2.0, KVM over IP, Virtual Media over LAN 9. Graphics: Aspeed AST2500 BMC

1. Single socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4†/ v3 family; QPI up to 9.6GT/s 2. Up to 1TB† ECC 3DS LRDIMM , up to DDR4- 2400†MHz ; 8x DIMM slots 3. 1 PCI-E 3.0 x4 (in x8), 2 PCI-E 3.0 x8, 1 PCI-E 3.0 x8 (in x16), 1 PCI-E 2.0 x2 (in x4), 1 PCI-E 2.0 x4 (in x8)

High Density 1U rack unit with, 12x Ethernet drives, Redundant Network Connectivity, Featuring Dual 10 GBase-T (4 ports), Layer-2 switching to integrated, 4TB Ethernet attached Drives, Dedicated IPMI / I2C management port

Dual socket 3rd Gen Intel® Xeon® Scalable processors, up to 72 Cores Per Node 16 ECC DDR4-3200: LRDIMM/RDIMM + 2 Intel® Optane™ Persistent Memory Dedicated Slots 2x 10Gbe Server remote management: IPMI 2.0 / KVM over LAN / Media over LAN per node 36 3.5"/2.5" Hot-swap SAS3/SATA3 drives (4 Hybrid NVMe), 2x Rear SATA Slots, 1x SATA/NVMe M.2 (form factor: 2280 and 22110) 7x 8cm hot-swap counter-rotate redundant PWM cooling fans 1600W Redundant Power Supplies Titanium Level (96%) HW RAID support via Broadcom® 3908

1. Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4†/ v3 family; QPI up to 9.6GT/s 2. Up to 2TB† ECC 3DS LRDIMM , up to DDR4- 2400†MHz ; 16x DIMM slots 3. 1 PCI-E 3.0 x16, 6 PCI-E 3.0 x8

Single Socket P+ (LGA-4189) 3rd Gen Intel® Xeon® Scalable processors. Up to 270W TDP. 8 DIMMs; Supports 3DS DDR4-3200: RDIMM/LRDIMM/Intel® DCPMM 1 PCI-E 4.0 x16 (FHHL) slot Intel® Ethernet Controller X550 2x 10GbE RJ45 10x Hot-swap 2.5'' All NVMe tool-less drive bays; Onboard 2x NVMe/SATA M.2 Redundant Platinum 860W Power Supply

1. Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4†/ v3 family; QPI up to 9.6GT/s 2. Up to 2TB† ECC 3DS LRDIMM , up to DDR4- 2400†MHz ; 16 DIMM slots 3. 1 PCI-E 3.0 x16 HHHL slot, 1 PCI-E 3.0 x8 HHHL slot, 1 SIOM slot

1. Dual Node (HA), Enterprise High Availability (SBB) Architecture (shared storage); Fully serviceable and redundant Two hot-pluggable systems (nodes) in a 4U form factor. Each node supports the following: 2. Dual Socket P (LGA 3647) support 2nd Gen Intel® Xeon® Scalable processors (Cascade Lake/Skylake)‡ 3. 16 DIMMs; up to 4TB 3DS ECC DDR4-2933MHz† RDIMM/LRDIMM, Supports Intel® Optane™ DCPMM†† 4. 2 PCI-E 3.0 x16 (HHHL), 1 PCI-E 3.0 x8 (HHHL) 5. 90x 3.5"/2.5" Hot-swap SAS3 drives, 2x Fixed slim SATA SSD, 2x NVMe M.2 (form factor: 22110) 6. Dual Broadcom 3616 IT Mode 7. Server remote management: IPMI 2.0 / KVM over LAN / Media over LAN 8. 6x 8cm hot-swap counter-rotate redundant PWM cooling fans 9. 2600W Redundant Power Supplies Titanium Level (96%) 10. Dedicated node to node connectivity featuring high performance NTB PCI-E 3.0 x16 , 1G private Ethernet, and IPMI for robust node fail-over support

1. Dual Socket E (LGA-4677) 5th/4th Generation Intel® Xeon® Scalable processors 2. Supports 32 DIMMs with 2DPC, up to 8TB memory capacity with 32 DIMMs of 256GB 3DS RDIMM DDR5-5600 ECC memory 3. Two PCIe 5.0 x16 slots & two AIOM connectors (OCP 3.0 SFF compliant) 4. 16x hot-swap E3.S (7.5mm) NVMe drive bays 5. Redundant Titanium 1600W Power Supplies

1. Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4†/ v3 family; QPI up to 9.6GT/s 2. Up to 3TB† ECC 3DS LRDIMM , up to DDR4- 2400†MHz ; 24x DIMM slots 3. 2 PCI-E 3.0 x16, 3 PCI-E 3.0 x8

Dual socket 3rd Gen Intel® Xeon® Scalable processors, up to 72 Cores Per Node 16 ECC DDR4-3200: LRDIMM/RDIMM 3 x PCI-E 4.0 x16 HHHL PCI-E slots 60 3.5"/2.5" Hot-swap SAS3/SATA3 drives, 2x Fixed slim SATA SSD, 2x NVMe M.2 (form factor: 2280 and 22110) 6x 8cm hot-swap counter-rotate redundant PWM cooling fans 2600W Redundant Power Supplies Titanium Level (96%) HBA Controller support via Broadcom® 3616 Server remote management: IPMI 2.0 / KVM over LAN / Media over LAN

1. Dual socket P (LGA 3647) supports Intel® Xeon® Scalable Processors, 3 UPI up to 10.4GT/s 2. Up to 2TB ECC 3DS LRDIMM, up to DDR4-2666MHz; 16 DIMM slots 3. 3 PCI-E 3.0 x16, 4 PCI-E 3.0 x8 (slot 2 & 3 occupied by controller and JBOD expansion port)