Storage Servers

1. 140 CPUs per 42U Rack 2. Dual socket P (LGA 3647) supports Intel® Xeon® Scalable Processors 3. Intel® C622 chipset 4. 2 Hot-plug 2.5" NVMe + 1 Hot-plug SAS3/SATA3 drives or 3 SAS3/SATA3 5. Broadcom 3108 HW RAID 6. 24 DDR4 LRDIMM/RDIMM slots 7. Dual 10G onboard 8. IPMI 2.0, KVM over IP, Virtual Media over LAN 9. Graphics: Aspeed AST2500 BMC

1. Dual Socket P (LGA 3647) support 2nd Gen Intel® Xeon® Scalable processors (Cascade Lake/Skylake)‡ 2. 16 DIMMs; up to 3TB 3DS ECC DDR4-2933MHz† RDIMM/LRDIMM, Supports Intel® Optane™ DCPMM†† 3. 1 PCI-E 3.0 x16 (HBA AOM), 1 PCI-E 3.0 x16 Left riser slot, 1 PCI-E 3.0 x8 Right riser slot, 1 PCI-E 3.0 x16 (AIOM)

1. Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4†/ v3 family; QPI up to 9.6GT/s 2. Up to 2TB† ECC 3DS LRDIMM , up to DDR4- 2400†MHz ; 16x DIMM slots 3. 1 PCI-E 3.0 x16, 6 PCI-E 3.0 x8

1. Dual Node (HA), Enterprise High Availability (SBB) Architecture (shared storage); Fully serviceable and redundant Two hot-pluggable systems (nodes) in a 4U form factor. Each node supports the following: 2. Dual Socket P (LGA 3647) support 2nd Gen Intel® Xeon® Scalable processors (Cascade Lake/Skylake)‡ 3. 16 DIMMs; up to 4TB 3DS ECC DDR4-2933MHz† RDIMM/LRDIMM, Supports Intel® Optane™ DCPMM†† 4. 2 PCI-E 3.0 x16 (HHHL), 1 PCI-E 3.0 x8 (HHHL) 5. 90x 3.5"/2.5" Hot-swap SAS3 drives, 2x Fixed slim SATA SSD, 2x NVMe M.2 (form factor: 22110) 6. Dual Broadcom 3616 IT Mode 7. Server remote management: IPMI 2.0 / KVM over LAN / Media over LAN 8. 6x 8cm hot-swap counter-rotate redundant PWM cooling fans 9. 2600W Redundant Power Supplies Titanium Level (96%) 10. Dedicated node to node connectivity featuring high performance NTB PCI-E 3.0 x16 , 1G private Ethernet, and IPMI for robust node fail-over support

1. Dual socket R (LGA 2011) supports Intel® Xeon® processor E5-2600 v4†/ v3 family; QPI up to 9.6GT/s 2. Up to 2TB† ECC 3DS LRDIMM , up to DDR4- 2400†MHz ; 16x DIMM slots

1. Single socket P (LGA 3647) supports Intel® Xeon® Scalable Processors 2. Up to 1TB ECC 3DS LRDIMM, up to DDR4-2666MHz; 8 DIMM slots 3. 1 PCI-E 3.0 x16, 1 PCI-E 3.0 x8, 1 PCI-E 3.0 x8, 1 PCI-E 3.0 x4 (in x8) 4. 2x 10GBase-T with Intel® X557 5. 12 Hot-swap 3.5" SAS/SATA drive bays

Dual Socket E (LGA-4677) 4th Generation Intel® Xeon® Scalable processors. Up to 270W TDP. Supports 32 DIMMs with 2DPC, up to 8TB memory capacity with 32 DIMMs of 256GB 3DS RDIMM/RDIMM DDR5 ECC memory Two PCIe 5.0 x16 slots & two PCIe x8 slots and two AIOM connectors (OCP 3.0 SFF compliant) 24x hot-swap E3.S (7.5mm) NVMe drive bays Redundant Titanium 2000W Power Supplies

1. Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4†/ v3 family; QPI up to 9.6GT/s 2. Up to 3TB† ECC 3DS LRDIMM , up to DDR4- 2400†MHz ; 24 DIMM slots 3. 2 PCI-E 3.0 x16 (LP) slots; 1 SIOM card support (flexible networking) Note: must bundle with Network card 4. IPMI 2.0 + KVM with dedicated LAN 5. 6 SAS3 or 4 NVMe + 2 SAS3 Hot-swap 2.5" drive bays 6. SAS3 support via Broadcom 3008; IT mode 7. Video via Aspeed AST2400 BMC 8. 4 heavy duty 8cm PWM fans with air shroud 9. 2200W Redundant Power Supplies Titanium Level 10. 2 M.2 Cards support

1. Single socket P (LGA 3647) supports Intel® Xeon® Scalable Processors 2. Up to 1TB ECC 3DS LRDIMM, up to DDR4-2666MHz; 8 DIMM slots 3. 1 PCI-E 3.0 x16, 1 PCI-E 3.0 x8, 1 PCI-E 3.0 x8, 1 PCI-E 3.0 x4 (in x8) 4. 2x 10GBase-T with Intel® X557 5. 36 Hot-swap 3.5" SAS/SATA drive bays with SES3 (24 front + 12 rear); 4 Internal fixed 2.5" drive bays 2 Hot-swap 2.5" NVMe/SATA (rear, optional) 6. SAS3 via Broadcom 3008 controller 7. Server remote management: IPMI 2.0 / KVM over LAN / Media over LAN 8. 7 High-performance 8cm PWM fans 9. 1200W Redundant Power Supplies Titanium Level (96%)

1. Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4†/ v3 family; QPI up to 9.6GT/s 2. Up to 1TB† ECC 3DS LRDIMM , up to DDR4- 2400†MHz ; 8x DIMM slots 3. SIOM card for multiple IO options 4. 90x 3.5" Hot-swap SAS3/SATA3 drive

1. Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4†/ v3 family; QPI up to 9.6GT/s 2. Up to 2TB† ECC 3DS LRDIMM , up to DDR4- 2400†MHz ; 16x DIMM slots 3. 2 PCI-E 3.0 x16 (FHHL) slots 4. 10 Hot-swap 2.5" SAS/SATA HDD bays (default 8 SATA3, 2 NVMe or SATA2) 5. Intel® X540 Dual port 10GBase-T LAN 6. I/O ports: 2 SuperDOM, 1 VGA, 1 COM, 2 USB 3.0 (front), 4 USB 2.0 (rear) 7. 2 SuperDOM (Disk on Module) ports 8. 700W Redundant Power Supplies Platinum Level High-efficiency

1. Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4†/ v3 family; QPI up to 9.6GT/s 2. Up to 2TB† ECC 3DS LRDIMM , up to DDR4- 2400†MHz ; 16x DIMM slots 3. 2 PCI-E 3.0 x16 (FHHL) slots 4. 10 Hot-swap 2.5" SAS/SATA HDD bays (default 8 SATA3, 2 NVMe or SATA2) 5. Intel® i350-AM2 Dual port GbE LAN 6. I/O ports: 2 SuperDOM, 1 VGA, 1 COM, 2 USB 3.0 (front), 4 USB 2.0 (rear) 7. 2 SuperDOM (Disk on Module) ports 8. 700W Redundant Power Supplies Platinum Level High-efficiency