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Servers GIGABYTE Builds Rackmounts Max I/O Systems Network Server GIGABYTE R272-Z32 (rev. A00/B00) - 6NR272Z32MR-00-AT

GIGABYTE R272-Z32 (rev. A00/B00) - 6NR272Z32MR-00-AT

Supports GRAID SupremeRAID NVMe/NVMe-oF RAID Card AMD EPYC™ 7003 processors with AMD 3D V-Cache™ Technology AMD EPYC™ 7003 series processor family Single processor, 7nm technology 8-Channel RDIMM/LRDIMM DDR4, 16 x DIMMs 2 x 1Gb/s LAN ports (Intel® I350-AM2) 1 x Dedicated management port 24 x 2.5" Gen3 NVMe hot-swappable bays 2 x 2.5" SATA/SAS hot-swappable bays on rear side

We also offer six months of free collocation in our TIER III data center.

Components are not the end — ask us for a custom server configuration. We will design the server, assemble it, expertly set it up, and provide extended or NBD warranty.

Product code 202.166181
Part number 6NR272Z32MR-00-AT
Manufacturer GIGABYTE
Availability On demand
Warranty 24 months
Weight 20 kg
$ 3,375.69
pc

  1. Server system integrator & worldwide shipping
  2. Personal approach and tailor-made servers
  3. NBD warranties & cross-shipping
  4. Private cloud infrastructure
  5. Pre-sales & After-sales support


Detailed information

Nothing Stacks Up To EPYC™
AMD EPYC 7003 Series Processors with AMD 3D V-Cache™ technology are raising the bar once more for breakthrough performance on targeted technical computing workloads like Electronic Design Automation, Computational Fluid Dynamics, and Finite Element Analysis software and solutions. Delivering breakthrough performance per core and performance per watt, the Zen 3 architecture maintains leadership in number of cores – up to 64, amount of L3 cache – 768MB, and 128 PCIe 4.0 lanes, while maintaining socket compatibility with existing 3rd Gen AMD EPYC platforms.

OCP 3.0 Ready
GIGABYTE’s G-,H-,R- * series offer servers that feature an onboard OCP 3.0 slot for the next generation of PCIe 4.0 add on cards. Advantages of this new type include - Easier Serviceability: simply slot in / pull out the card without needing to open the server chassis; tool less design, and Larger Thermal Envelope: more space for heat sink provides an increased power budget for new & emerging capabilities

Hardware-level Root of Trust
Protection is built in the silicon to ensure systems will not be vulnerable to security attacks or cyber threats. This hardware-level root of trust (ROT) helps isolate the system as the boot process starts to make sure a verified code is used.

Optional TPM 2.0 Module
For hardware-based authentication, the passwords, encryption keys, and digital certificates are stored in a TPM module to prevent unwanted users from gaining access to your data. GIGABYTE TPM modules come in either a Serial Peripheral Interface (SPI) or low pin count (LPC) interface.

Automatic Fan Speed Control
GIGABYTE servers are enabled with Automatic Fan Speed Control to achieve the best cooling and power efficiency. Individual fan speeds will be automatically adjusted according to temperature sensors strategically placed in the servers.

Cold Redundancy
To take advantage of the fact that a PSU will run at greater power efficiency with a higher load, GIGABYTE has introduced a power management feature called Cold Redundancy for servers with N+1 power supplies. When the total system load falls lower than 40%, the system will automatically place one PSU into standby mode, resulting in a 10% improvement in efficiency.

Smart Crises Management and Protection (SCMP)
SCMP is a GIGABYTE patented feature which is deployed in servers with non-fully redundant PSU design. With SCMP, in the event of faulty PSU or overheated system, the system will force the CPU into an ultra-low power mode that reduces the power load, which prevents the system from unexpected shutdown and avoids component damage or data loss.

Dual ROM Architecture
If the ROM that stores the BMC and BIOS fails to boot, the system will reboot with the backup BMC and/or BIOS replacing the primary. Once the primary BMC is updated, the ROM of the backup BMC will automatically update the backup through synchronization. For the BIOS, it can be updated based on user's choice of firmware version.

    • Dimensions
    Form Factor 2U
    WxHxD, mm 438 x 87.5 x 660
    • Motherboard
    Part number MZ32-AR0
    • CPU
    Model AMD EPYC™ 7003 Series processors
    Technology AMD 3D V-Cache™ Technology,
    Single processor, 7nm technology, Up to 64-core, 128 threads per processor
    TDP 280W
    • Socket and Chipset
    Chipset System on Chip
    • Memory
    Slots 16 x DIMM DDR4
    Memory architecture 8-Channel
    RDIMM modules up to 128GB supported
    LRDIMM modules up to 128GB supported
    3DS RDIMM/LRDIMM modules up to 256GB supported
    Memory speed Up to 3200*/2933 MHz
    • LAN
    Rear side 2 x 1GbE LAN ports (1 x Intel® I350-AM2)
    Support NCSI function Yes
    Management LAN 1 x 10/100/1000
    • Storage
    Front side 24 x 2.5" Gen3 NVMe hot-swappable bays
    Rear side 2 x 2.5" SATA/SAS hot-swappable bays
    RAID N/A
    • Expansion Slots
    Total 1 x PCIe Gen4 low-profile slot Slot_6: 1 x PCIe x16 (Gen4 x16) slot, occupied by CNV3024, 4 x NVMe HBA
    Slot_5: 1 x PCIe x16 (Gen4 x8) slot
    Slot_4: 1 x PCIe x16 (Gen4 x16) slot, occupied by CNV3024, 4 x NVMe HBA
    Slot_3: 1 x PCIe x16 (Gen4 x16) slot, occupied by CNV3024, 4 x NVMe HBA
    Slot_2: 1 x PCIe x8 (Gen3 x0 or x8) slot, disabled
    Slot_1: 1 x PCIe x16 (Gen3 x16 or x8) slot, occupied by CNV3024, 4 x NVMe HBA
    OCP 2.0 mezzanine slot 1x with PCIe Gen3 x16, occupied by CNVO124, 4 x NVMe HBA
    M.2 slots - 2x M-key
    - PCIe Gen3 x4
    - Supports 2242/2260/2280 cards
    • Backplane Board
    Front side - CBP20O5 PCIe Gen3 x4
    Rear side - CBP2021 SATA 6Gb/s or SAS 12Gb/s
    • TPM
    TPM header SPI interface
    Optional TPM2.0 kit CTM010
    • Power Supply
    Certification 80 PLUS Platinum redundant
    Power 1200W
    QTY 1+1
    • Fans
    System 4 x 80x80x38mm (16,300rpm)
    • Weight
    Net Weight 17.78 kg
    Gross Weight 24.76 kg
    • Video
    Integrated Aspeed® AST2500
    PCIe bus interface 2D Video Graphic Adapter
    Resolution 1920x1200@60Hz 32bpp

Parameters

Size in U 2
Depth (mm) 660
CPU manufacturer AMD
Socket SP3
HDD disks 26
2.5" Drive bays 26
3.5" Drive bays 0
NVMe slots 24
Total amount of PCIe 3
OCP/AIOM 1
Power (W) 1300
Efficiency certification Titanium

Price development



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