Supermicro

Socket P+(LGA 4189) Supports 3rd Generation Intel® Scalable Processors (Dual Socket) 16 DIMMs Supports up to 5TB Intel® Optane Persistent Memory 200 Series; up to 4TB DDR 4-3200 Network Connectivity Via AIOM (OCP 3.0 Compliant) NVMe/SATA/SAS options AIOM and M.2 support; 1 AIOM card support (PCI-E 4.0) 6 or 8 Hot Swap Drives 2.5" NVME or SAS/SATA 2 M.2 internal drives Front access node for better serviceability; 8x 3.5” hot-swap HDDs per node

1. Single socket P (LGA 3647) supports Intel® Xeon® Scalable Processors 2. Up to 768GB ECC 3DS LRDIMM, up to DDR4-2666MHz; 6 DIMM slots 3. 2 PCI-E 3.0 x16 slots (support double-width GPU), 1 PCI-E 3.0 x16 low-profile slot (center right) 4. 6 Hot-swap 2.5" SAS/SATA drive bays 5. 2x 10GBase-T LAN ports via Intel X550 6. Dual M.2 Mini-PCIe support 2280 7. 8 Heavy duty 4cm counter-rotating 4cm fans with air shroud & optimal fan speed control 8. 1400W High-efficiency Power Supply Platinum Level (94%+)

1. Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4†/ v3 family; QPI up to 9.6GT/s 2. Intel® C612 chipset 3. Up to 1TB† ECC 3DS LRDIMM , up to DDR4- 2400†MHz ; 8 DIMM slots 4. Expansion slots: 4x PCI-E 3.0 x8 5. Intel® 82599ES Dual port 10G SFP+

1. Single AMD EPYC™ 7000-Series Processor 2. Up to 2TB Registered ECC DDR4 2666MHz SDRAM in 16 DIMMs 3. Expansion slots: 2 PCI-E 3.0 x16 (FH/HL) slots, 1 PCI-E 3.0 x16 (LP) slot M.2 Interface: PCI-E 3.0 x2 (NVMe based) M.2 Form Factor: 2280, 22110 M.2 Key: Onboard M-key Number of M.2: 2

1. Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v3 family; QPI up to 9.6GT/s 2. Up to 1TB ECC DDR4 2133MHz; 16x DIMM slots 3. 3 PCI-E 3.0 x16, 3 PCI-E 3.0 x8 slots 4. Intel® i350 Dual port GbE LAN

-10-Gigabit Ethernet layer 2/3 Switch module -offers advanced switching features and connection to 10-Gigabit Ethernet networks - Link Aggregation - 8 groups with 8 members per group - LACP Support - Link Layer Discovery Protocol (802.1AB)

1. Single Socket E (LGA-4677) 4th Gen Intel® Xeon® Scalable processor (per node) 2. Intel® C741 Chipset 3. 8 DIMMs; Up to 2TB ECC DDR5-4800: R-DIMM/R-DIMM 3DS (per node) 4. 2 PCIe Gen5 x16 HHHL slot (per node) 5. 2 NVMe M.2 2280 / 25110 (per node)

SIOM Single-port FDR IB 1 QSFP+ Port & Dual-port(Retail)

Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4†/ v3 family; QPI up to 9.6GT/s. Up to 2TB† ECC 3DS LRDIMM , up to DDR4- 2400†MHz ; 16 DIMM slots. 4 PCI-E 3.0 x16 slots 2 PCI-E 3.0 x8 (1 in x16) slots support Thunderbolt 2.0 AOC, 1 PCI-E 2.0 x4 (in x8) slot; Up to 4 NVIDIA® GPU. I/O ports: 1 VGA, 2 COM, 2 GbE, 10 USB 2.0, & 1 IPMI Dedicated LAN. 8 Hot-swap 3.5", 3 Fixed 5.25" and 1 Fixed 3.5" Drive Bays. 4 Heavy Duty Fans, 2 Exhaust Fans, and 2 Active Heatsink with Optimal Fan Speed Control. 2000W High efficiency (96%) Redundant PSU; Titanium Level. Tower or Rackmount GPU Kit for passive GPU/Xeon Phi support (MCP-320-74701-0N-KIT).

MicroFit (2x1 to 2x1),PH3.0,30cm,11A/p,16AWG,RoHS

Cable Supermicro CBL-SAST-1256X-85 SAS/SATA/NVMe internal