GIGABYTE H253-Z10-LAP1 (rev. 3.x) - 6NH253Z10DZ000LCP1
Direct liquid cooling solution 2U 4-node front access server system Single AMD EPYC™ 9005/9004 Series Processors per node 12-Channel DDR5 RDIMM, 24 x DIMMs per node Dual ROM Architecture 8 x 1Gb/s LAN ports via Intel® I350-AM2 2 x CMC ports 8 x E1.S Gen4 NVMe hot-swap bays 12 x M.2 slots with PCIe Gen5 x4 and SATA interface 4 x OCP NIC 3.0 PCIe Gen5 x16 slots Dual 3000W 80 PLUS Titanium redundant power supply
We also offer six months of free collocation in our TIER III data center.
Components are not the end — ask us for a custom server configuration. We will design the server, assemble it, expertly set it up, and provide extended or NBD warranty.
| Product code | 202.181699 |
|---|---|
| Part number | 6NH253Z10DZ000LCP1 |
| Manufacturer | GIGABYTE |
| Availability | On demand |
| Warranty | 36 months |
| Weight | 31 kg |
Server system integrator & worldwide shipping
Personal approach and tailor-made servers
NBD warranties & cross-shipping
Private cloud infrastructure
Pre-sales & After-sales support
Detailed information
Rack servers
Highly flexible, scalable rack servers optimized for demanding applications in data centers. Rack density from 1U to 5U, servers are designed for single and multi-socket varieties of x86 processors from AMD and Intel as well as for ARM processors from Ampere.
Applications Include
Big Data
High Performance Computing (HPC)
Hyper-converged infrastructure (HCI)
Software-defined Storage (SDS)
Virtualization
Only the best with GIGABYTE
Strong R&D and forward ideas to deliver the values that can help you succeed in the future.
High Performance
Servers and motherboards by GIGABYTE are tested to ensure peak performance for demanding CPU workloads. All the latest technology is supported.
Compute Density
One single socket solution can outperform many dual CPU servers. Dual socket models also support up to hundreds of cores in a 1U-5U chassis. More compact performance.
Fast & Stable Connectivity
Keeping pace with the challenges for next gen technology, well designed GIGABYTE boards provide users the signal integrity for newest PCIe generation.
Modularity
Building block designs allow new models to quickly reach the market. Users can now have BMC on a OCP module customized by GIGABYTE.
Collaboration
GIGABYTE and its partners have maintained a healthy relationship that values shared knowledge in order to get the latest technology into data centers.
Optimal Price
A broad portfolio of servers and products allows customers to only select the features they require which results in a lower total cost of ownership (TCO).
High Density
Multi-node servers enhance performance by distributing workloads across nodes, ensuring reliability and scalability. Key benefits include redundancy, simplified management, lower TCO, and improved efficiency.
| Dimensions | |
| Form Factor | 2U 4-Node Front access |
| Server Dimensions ( WxHxD ) |
447 x 87 x 887 mm |
| Packaging Dimensions | 1181 x 718 x 336 mm |
| Motherboard | |
| Part Name | MZ13-SH0 |
| Processor | |
| CPU | AMD EPYC™ 9005 Series Processors AMD EPYC™ 9004 Series Processors |
| Socket | SP5 |
| QTY | 4 |
| Chipset | System on Chip |
| System Memory | |
| Memory Type | RDIMM DDR5 |
| Memory Frequency | AMD EPYC™ 9005: 4000 / 4400 / 5200 MTs AMD EPYC™ 9004: 3600 / 4800 MTs |
| Memory Slots | 96 |
| Storage | |
| Disk Bays | 8x 9.5mm E1.S Gen4 NVMe Hot-Swap |
| M.2 | 4x M.2 (2280/22110) PCIe Gen5 x4 8x M.2 (2280) SATA |
| PCI Express | |
| OCP | 4x OCP NIC 3.0 Gen5 x16 |
| Input / Output | |
| LAN | 8x 1 Gbps LAN (4 x Intel® I350-AM2) 4x 10/100/1000 Mbps Management LAN 2x CMC port |
| USB | 8x USB 3.2 Gen1 |
| Video | 4x Mini-DP |
| Backplane Board | |
| N/A | |
| Security Modules | |
| TPM | 1x TPM header with SPI interface *Optional TPM 2.0 kit: CTM010 |
| Power Supply | |
| Certification | 80 PLUS Titanium |
| Power | 3000 W |
| QTY | 2 |
| Environment Properties | |
| Operating | Temperature: 10°C to 35°C Humidity: 8% to 80% (non-condensing) |
| Non-operating | Temperature: -40°C to 60°C Humidity: 20% to 95% (non-condensing) |
Parameters
| Size in U | 2 |
|---|---|
| Depth (mm) | 902 |
| CPU manufacturer | AMD |
| Socket | SP5 |
| HDD disks | 20 |
| 2.5" Drive bays | 0 |
| 3.5" Drive bays | 0 |
| NVMe slots | 8 |
| Total amount of PCIe | 0 |
| OCP/AIOM | 1 |
| Power (W) | 3000 |
| Efficiency certification | Titanium |
