Cloud & Virtualization

1. Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4†/ v3 family; QPI up to 9.6GT/s 2. Up to 3TB† ECC 3DS LRDIMM , up to DDR4- 2400†MHz ; 24 DIMM slots 3. 1 PCI-E 3.0 x16 slot (FH, 10.5" L), 7 PCI-E 3.0 x8 slots (5 FH, 10.5" L, 1 LP, 1 Internal LP)

1. Single socket P (LGA 3647) supports Intel® Xeon® Scalable Processors 2. Up to 768GB ECC 3DS LRDIMM, up to DDR4-2666MHz; 6 DIMM slots 3. 2 PCI-E 3.0 x16 (FHFL) slots, 1 PCI-E 3.0 x8 (LP) slot 4. 4 Hot-swap 3.5" SATA3 drive bays

1. Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4†/ v3 family; QPI up to 9.6GT/s 2. Up to 3TB† ECC 3DS LRDIMM , up to DDR4- 2400†MHz ; 24 DIMM slots 3. 6 PCI-E 3.0 x8 slots (4 FH, 10.5" L, 1 LP, 1 Internal LP) 4. 4x 10GBase-T ports 5. 12 Hot-swap 3.5" Drive Bays: Default 8 SATA3 ports, 4 NVMe ports; Optional 12 SAS3 ports via AOC; Optional 2 hot-swap 2.5" rear drive bays for SSDs 6. 4 heavy duty fans w/ optimal fan speed control 7. 1000W High efficiency (96%) Redundant PSU; Titanium Level

1. Octa Socket P (LGA 3647) support Intel® Xeon® Scalable Processors 2. Up to 12TB 3DS ECC LRDIMM, up to DDR4-2666MHz; 96 DIMM slots 3. 23 or 39 (OEM) PCI-E 3.0 slots include: 8 FH x16 PCI-E cards or 8 GPUs or 16 U.2 NVMe + 8 FHFL x16 PCI-E cards or 16 U.2 NVMe + 8 FHFL x16 PCI-E cards or 16 U.2 NVMe + 2 LP x8 (in x16) PCI-E internal cards (storage module) + 5 FHHL x16 PCI-E cards (rear)(Up to 39 PCI-E 3.0 slots for OEM) 4. 4 10Gb LAN (SIOM), 1 dedicated LAN for IPMI Remote Management, 1 VGA, 2 USB 2.0, 1 COM via KVM 5. 16 Hot-swap 2.5" SAS3 drive bays (w/ RAID cards); 8x 2.5" or 6x 3.5" internal drive bays (w/ RAID cards) 6. 8x 9cm Hot-swap counter-rotating rear fans 7. 5x 1600W (N+2) Redundant Power Supplies, Titanium Level (96%)

1. NEBS Level 3 Certified 2. Dual Socket P (LGA 3647): Intel® Xeon® Gold 6240R 3. 24 DIMMs; up to 1.5TB 3DS ECC DDR4-2933MHz† RDIMM 4. Up to 8 PCI-E Add-on Cards 5. Flexible LAN options 6. 6 Hot-swap 2.5" drive bays 6 NVMe/SATA ports (NVMe from CPU1) or 6 SATA ports 7. 6 Hot-swap Heavy duty 6cm PWM fans 8. Redundant Power Supplies 1300W DC Power Supplies 9. GPU Support (Optional

1. Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4†/ v3 family; QPI up to 9.6GT/s 2. Up to 2TB† ECC 3DS LRDIMM , up to DDR4- 2400†MHz ; 16x DIMM slots 3. 2 PCI-E 3.0 x16 (FHHL) slots 4. 10 Hot-swap 2.5" SAS/SATA HDD bays (default 8 SATA3, 2 NVMe or SATA2) 5. Intel® X540 Dual port 10GBase-T LAN 6. I/O ports: 2 SuperDOM, 1 VGA, 1 COM, 2 USB 3.0 (front), 4 USB 2.0 (rear) 7. 2 SuperDOM (Disk on Module) ports 8. 700W Redundant Power Supplies Platinum Level High-efficiency